Universal I/O Module Specification

Universal I/O modules provide a way to customize I/O interfaces to timing modules. By releasing the module specification users are enabled to build modules of their own meeting their special I/O requirements.

An Universal I/O module is plugged into a standard 2x10 dual in line 2.54 mm header on the carrier board. The part number of the mating plug used on the Universal I/O module is:

Manufacturer Product Number
AMP/Tyco 1-969973-0

Two supply voltages are provided on the pin header: +3.3 VDC and +5 VDC. The I/O signalling levels on the header are +3.3V LVCMOS and signals must not exceed +3.3V otherwise severe damage may be caused to the carrier board or the EVG/EVR if a transition board is used. There are separate pins for input and output signals. The signals should be source terminated with a driver impedance matching the characteristic impedance of 50 ohm of the PCB traces.

Universal I/O Module Socket Schematic
Universal I/O Module Socket Schematic

 

Pin Description
1 Ground
2 (reserved)
3 Universal Input 1 (signal from Universal I/O module to carrier)
4 (reserved)
5 Ground
6 Ground
7 Universal Output 1 (signal from carrier to Universal I/O Module)
8 +3.3 VDC supply
9 (reserved)
10 +3.3 VDC supply
11 (reserved)
12 +5 VDC supply
13 Universal Input 0 (signal from Universal I/O module to carrier)
14 +5 VDC supply
15 Ground
16 Ground
17 Universal Output 0 (signal from carrier to Universal I/O Module)
18 (reserved)
19 Ground
20 (reserved)

Note! Pins labeled (reserved) may be connected on the carrier board. These pins should be left unconnected on the Universal I/O Module. During power up/power down all I/O signals have weak pull-up resistors of approximately 10 kohm. To make sure signals levels are kept low during power cycling a pull-down resistor of 1 kohm to ground can be used.

The mechanical dimensions of an Universal I/O Module with Lemo 00-series sockets is shown in the figure below.

Mechanical lay-out of Universal I/O Module
Mechanical lay-out of Universal I/O Module